During the 2021 IEEE Photonics Conference, Prof. Lukas Chrostowski presented on the progress made by SiEPICfab on Photonic Wire Bonding for Integrated Photonics. The latest results include integration of a laser on a silicon photonics chip. This laser integration process will be made available publicly in an upcoming MPW, dubbed “SiEPICfab-Shuksan” which will be accessible to registrants of the ePIXfab-SiEPICfab Joint Workshop on Laser Integration in Silicon Photonics.